Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
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The device consists of eight npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads.
The collector-current rating of each Darlington pair is mA. The Darlington pairs may be connected in parallel for higher current capability.
The ULNA has a 2. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Products conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters. Input B Output C 7. Collector-emitter voltage. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The package thermal impedance is calculated in accordance with JESD CL includes probe and jig capacitance. NRND: Not recommended for new designs.
Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.
Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.
To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used.
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